Job Description

Marvell Advanced Packaging R&D Team

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer's most challenging designs and integrations with industry-leading packaging technologies.

What You Can Expect

• Create thermal solutions for datacenter silicon package, create design, develop material and process, and validate solutions at component and system levels.
• Work with external stakeholders to define thermal roadmap.
• Explore technologies beyond what is currently available, make recommendations, and create and protect IP to maximize performance.
• Explore technology feasibility and create proof-of-concept samples.
• Collaborate with IP, Si design, package design, production and test teams.

What We're Looking For

• Experience in advanced package technology with deep understanding of heat transfer, fluid dynamics and material science.
• Experience with creating thermal solutions at the component and system levels.
• Experience in managing vendors, substrate manufacturers, OSATs and foundries.
• Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience. OR Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.

Skills Needed To Be Successful In This Role:

• Mastery in tools and workflows: Icepak, Flowtherm, Celius; Solidworks, Creo
• Deep understanding of fundamental concepts: heat transfer, fluid dynamics and material science
• Deep understanding of active and passive cooling solutions and their integration at component and system level.
• Understanding of system integration of a silicon package with heat sink, board, server chassis, rack. Thermal management for scale-up and scale-out.
• Deep understanding of mechanical and thermal properties of materials and how they impact thermal management.
• Understanding of thermal management for 2.5D/3D packages including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC
• Experience with design and testing: thermal TV, DAQ, calibration curves, LabVIEW, thermocouples, airflow, thermal chambers.
• Understanding of chip-package interactions and failure mechanism at component and board level.

• Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.
• Ability to influence vendors to align their roadmap with company goals.

• Strong communication, presentation and documentation skills

The Ideal Candidate Would Have:

• Understanding of package, interposer, silicon, substrates and PCB designs.
• Understanding signal integrity and power integrity.
• Experience in packaging for datacenter market segment.

Expected Base Pay Range (USD): 125,900 - 186,260, $ per annum. The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

At Marvell, we offer a total compensation package with a base, bonus and equity. Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com .

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